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Kyocera Announces Innovative Epoxy Molding Compound, High-Thermal-Conductive Silver Sintering Paste and Revolutionary TOROKERU Sheet

The new Kyocera innovations were presented at the PCIM exhibition in Nuremberg from 16 – 18 May in hall 6, stand 301

Kyoto/London - Kyocera Corporation has recently developed a high-thermal-conductivity epoxy molding compound with a thermal conductivity of 6W/mK. This marks a significant increase in the conventional thermal conductivity of 0.9-3W/mK and thus enhances the protection of semiconductor components from light, temperature, humidity, dust and physical shock.

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Kyocera Brings Low-Temperature, High-Thermal-Conductivity Silver Sinter Paste to the European Market

The innovative paste has the ideal preconditions for high-reliability applications in automotive modules, power modules or in the semiconductor industry and other fields, whose effective operation depends in heat dissipation

Kyoto / Neuss - The Kyocera Corporation launches the innovative environmentally friendly XT2773R7 Silver Sinter Paste in Europe – a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders. Kyocera’s lead-free, pressureless Silver Sinter Paste exhibits excellent thermal and electrical performance as well as an extremely strong adhesion to bare copper. These characteristics make this new paste ideal for high-reliability applications in which heat dissipation is crucial, such as power semiconductors, automotive modules and high-brightness light emitting diodes (LEDs).

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Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market

The innovative molding compound stands out on account of its unrivaled 6W/mK and its high flowability. It can be applied not only to power modules, but also to BGA packages with long Cu wires.

Kyoto / Neuss - The Kyocera Corporation has recently developed a high-thermal conductivity Epoxy Molding Compound with a thermal conductivity of 6W/mK. This stands for a significant increase of the conventional thermal conductivity of 0.9-3W/mK and thus enhances the protection of semiconductor components from light, temperature, humidity, dust and physical shock.

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