Epoxy Molding Compounds for Semiconductors

We have cultivated the advanced technologies for Epoxy Molding Compound (EMC) over many years, and our EMC products have been used widely across many industries.

In order to support our customers to achieve lead-free packaging technology and highly reliable performance in high-temperature applications, we have developed environment-friendly products across all EMC grades by adopting non-halogen technology.

EMC for BGA package

EMC for fingerprint sensor package

EMC for power module

Mold Underfill (MUF) EMC for flip-chip package

EMC for lead frame package

Sheet EMC for PLP/WLP