Power - AMB Substrates
Benefit from our experience and know how
Kyocera is one of the leading manufacturers of SiN AMB substrates for a wide range of applications. With our longterm experience and market know how we can offer you the best support - from your first idea until the market launch.
High reliability AMB (ActiveMetalBonding) process
- Ti compound - alloy (Ag-Cu)
- Brazing Process at 850°C in vacuum
→ High adhesion strength Cu to ceramics
Features
- High reliabilty due to AMB technology
- Various plating options (Ni, NiAu, NiPdAu, direct Ag)
- High thermal conductivity
- Multilayer structure feasible
- Various connector possibilities
Reference markets
- Automotive - TS16949 qualified
- Space - ESA qualified
- Avionics
- Industrial
