Benefit from our experience and know how

Kyocera is one of the leading manufacturers of SiN AMB substrates for a wide range of applications. With our longterm experience and market know how we can offer you the best support - from your first idea until the market launch.

High reliability AMB (ActiveMetalBonding) process

• Ti compound - alloy (Ag-Cu)
• Brazing Process at 850°C in vacuum
  → High adhesion strength Cu to ceramics

Features

• High reliabilty due to AMB technology
• Various plating options (Ni, NiAu, NiPdAu, direct Ag)
• High thermal conductivity
• Multilayer structure feasible
• Various connector possibilities

Reference markets

• Automotive - TS16949 qualified
• Space - ESA qualified
• Avionics
• Industrial