10Gbps Glass-to-Metal TO-Can PKG with ALN Submount

KYOCERA introduces a new glass-to-metal TO-Can package to fit 10Gbps transceiver module multi-source agreement (MSAs) such as XFP, Xenpak, Xpak, and X2. Aluminum Nitride (ALN) ceramic submount with thin-film resistor for impedance matching and bond pads for passive is already brazed onto this metal package. This package is suitable for 10Gbps short-reach uncooled edge-emitting lasers.

This product will be exhibited at ECOC2004 exhibition (6th - 8th September 2004, Stockholm International Fair, Stockholm, Sweden).