KYOCERA Presents SLC Wiring Boards and IC Packages

High Density Organic Flip chip Substrates

30 April 2010

Kyoto / Neuss, 30 April 2010 - The Japanese technology company KYOCERA - one of the worldwide leading manufacturers of ceramic packages for the microelectronics industry - will present High Density Organic Flip Chip Substrates at the SMT show in Nuremberg from June 8th to June 10th (Hall 9 /Stand 9-241).

Kyocera SLC (Surface Laminate Circuitry) flip chip substrate technology offers solutions for applications that require high I/O count such as LSI and OverGHz high speed devices through the use of the industry's highest and finest density design rules and the smallest possible footprint. Applications such as Network Processors, Graphics Processors, Optical Interface cards and digital electric appliances such as mobile phones and digital cameras can be addressed.

For products requiring System in Package (SiP) techniques, Kyocera offers the perfect substrate solution for a wide range of applications including mobile phones, digital cameras and hand held devices. Kyocera can work together with customers to design SiP substrate solutions that meet all product requirements and line and space capabilities of 20µm/20µm in the build-up layers can be realized in high volume production. Multiple assembly techniques such as flip chip and wire bonding patterns can be provided for in the same designs allowing high levels of integration to be achieved. This product line is characterized by Kyocera’s well known high performance, excellent reliability and cost competitiveness. Kyocera's SLC Technology is RoHs compliant and ISO9001/ ISO14001 certified.

Press Material