KYOCERA Copper Bonded Silicon Nitride Substrate Achieved 5000 Cycles of Temperature
30 May 2005
KYOCERA announced its Copper Bonded Silicon Nitride Ceramic Substrate achieved 5,000 cycles of air to air temperature cycling test with a condition of –60 to +175 degrees centigrade without any failure.
stronger method of adhering copper to ceramics when compared to conventional copper bonding methods without metallization, typically using a copper oxide process. The AMB copper bonded Silicon Nitride substrate is much stronger, mechanically than conventional copper bonded Alumina and Aluminum Nitride substrates. Kyocera AMB Silicon Nitride technology is suitable as a substrate material for use in power microelectronics applications in automotive, aerospace and other harsh environment.