MEMS Sensors Packaging
High class and low cost ceramic technology
A thinner, smaller surface mount type leadless package or other customized design structure is available for MEMS which have an open air cavity structure or other specifications.
We offer a variety of packages to meet market demands and full support of high design technology to provide optimized packaging solutions for your requirements.
- 3D design (air cavity type, hermetic sealing availabilities)
- Small hysteresis (superior properties provide less mechanical stress with MEMS)
- No deformation during assembly and use (easy to use and respect the performance of MEMS)
- Wide range for package dimensions (miniaturization)
- Non magnetic solution available