Kyocera Brings High-Temperature, High-Thermal-Conductivity Epoxy Molding Compound to the European Market

The innovative molding compound stands out on account of its unrivaled 6W/mK and its high flowability. It can be applied not only to power modules, but also to BGA packages with long Cu wires.

14 April 2016

Kyoto / Neuss - The Kyocera Corporation has recently developed a high-thermal conductivity Epoxy Molding Compound with a thermal conductivity of 6W/mK. This stands for a significant increase of the conventional thermal conductivity of 0.9-3W/mK and thus enhances the protection of semiconductor components from light, temperature, humidity, dust and physical shock.

In general, there are two approaches to reduce the thermal resistance of the semiconductor packages: Either a heat sink or a radiation fin (sometimes both are used in combination) can be applied. The alternative would be to use a molding compound with a high thermal conductivity. In case of the latter approach, the molding compound is required to have the appropriate mold shrinkage, a high adhesion strength and an excellent flowability in addition to the high thermal conductivity.

The new product has achieved an extremely high thermal conductivity by a higher alumina filler loading while excellent flowability is still maintained. Transfer moldings as well as compression moldings are available.

By using our high thermal conductivity molding compound, the thermal dispersion of packages becomes higher. Thus, it is possible to eliminate the heatsink and also easier to design the package structure.

Kyocera is actively engaged in the development of environmentally friendly products and strives to reduce the use of environmentally harmful materials and processes as much as possible in the industries it supports.

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