Kyocera’s Semiconductor Components Division is dedicated to developing cutting-edge non-magnetic applications for sectors such as medicine, industry and avionics.

30 September 2014

Kyoto / Neuss - Kyocera’s development of this innovative ceramic packaging is based on established HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options. Kyocera is now presenting a new type of HTCC with platinum metallization on the top surface and in ceramic multilayering. Besides the “non-magnetic” property of platinum metallization, this unique technique and choice of materials also allows for use in high temperature applications up to 1.000°C. For instance, the wireless SAW temperature sensor of the company Vectron, which can be used to screen temperatures up to 600° C, has been developed based on Kyocera’s component package. Furthermore, customized packages for individual applications can be delivered, for example, the design can include or omit leads and can also be made compatible with a surface mountable concept if required.

With this new packaging solution Kyocera aims to meet the new demands of various business sectors and in a broad range of applications for which hyperfine position sensing is fundamental. Among others, these include highly sensitive medical equipment such as magnetic resonance tomography; electronic applications in aeronautics including atomic clocks and sensors; vacuum equipment in electron microscopy; as well as other industrial processes like down-hole drilling for exploration purposes.

The new platinum multilayer technology (HTCC) offers an innovative and unique approach to “non-magnetic” ceramic packaging applications, where the proven reliability of ceramics are required. Moreover, it also enables customers to push the limits of HTCC packaging towards higher temperature applications in harsh environments, such as automotive sensors and oil exploration.

“In any field where extremely sensitive technology is responsible for smooth operation, the non-magnetic characteristics of this product will be highly valued,” explains Shigeru Koyama, president of Kyocera Fineceramics GmbH. “It is always important for us to offer our clients from different sectors new opportunities with our technology.”

This new offering from Kyocera’s Semiconductor Components Division complements the broad range of electronic packaging solutions the company offers for a wide variety of applications based on ceramic, metal and organic material technologies. This range comprises ultra-high vacuum products, opto-electronics, broadband telecommunications, mobile and satellite communications, surveillance system, sensors — including image sensors and MEMS — automotive electronics, medical devices as well as computers and consumer electronics.

For more information about Kyocera:

Press Material